Thermal Management

As a leader in thermal management, Methode Power Solutions Group provides cooling solutions to protect power electronics in the most demanding environments. Methode Power Solutions Group designs and manufactures thermal solutions such as extruded aluminum heat sinks, bonded-fin heat sinks, liquid-cooled chill plates and SCR Clamps. Our experienced teams of applications engineers, supported by our regional design centers, collaborate with our customers to provide thermal analysis support and quickly turn concepts into high-performance, cost-effective solutions

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Extruded Heat Sinks

Since the development of power semiconductors, cooling needs have been provided by attaching a one-piece aluminum extrusion to provide a large surface cooling area. Methode provides a broad selection of tooled, SCR and high-ratio extrusion profiles.

Data Sheets

Extrudable Aluminum Alloys Verified – Data Sheet for Product (PDF)

Extruded Fin Heat Sinks Design Guide – Data Sheet for Product (PDF)

Extruded Fin Heat Sinks Dimensional Tolerances – Data Sheet for Product (PDF)

High Ratio Extrusion Profiles – Data Sheet for Product (PDF)

Methode Tooled Extrusion Profiles – Data Sheet for Product (PDF)

Case Studies